Diamond grinding wheel Product List and Ranking from 12 Manufacturers, Suppliers and Companies

JAM 【Diamond Grinding Stone】 DTL-600/1000

Auxiliary tools for high-precision processing and measurement.

The material is SKS. Hardened to HRC60° and finished by grinding. ● Sign bars for angle setting and measurement ● Positioning auxiliary blocks usable for both cutting and grinding processes ● Auxiliary dressers for shaping grinding wheel on grinding machines ● Grinding wheels for polishing and lapping of machine parts, mold parts, etc. ● This is a resin bond type diamond grinding wheel suitable for fitting, lapping, and fine edge rounding of mold parts and machine parts. Applicable materials: carbide, hardened steel, general steel, ceramics, glass, silicon, ferrite, porcelain, stone, concrete, carbon, gemstones, FRP.

Company：日本オートマチックマシン
Price：Other

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Diamond grinding wheel

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Special diamond grinding stone with a honeycomb structure

Are you wasting whetstone with dressing? High-efficiency grinding of cutting-edge electronic materials.

The diamond section has a higher bonding strength compared to the core section. When the workpiece is pressed against it, the core section wears out faster. The diamond section, which is approximately 10 microns higher (depending on the diamond grain size), will always be in contact with the workpiece. The size of the core section and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution of the diamond against the workpiece, thus maximizing the power of the grinding wheel. <Features> - Ideal cutting performance and grinding wheel lifespan with the size and thickness of the honeycomb! - The abrasive grains in the core section enhance processing efficiency due to the action of free abrasive grains. - Maximizes non-dress and dress intervals. - Load distribution can be controlled through diamond patterning.

Company：アローズエンジニアリング
Price：Other

Other abrasives
Diamond grinding wheel

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Perfect for leveling surfaces! Diamond sharpening stone Magic Stone

Quickly removing dirt, swiftly smoothing the surface, and instantly chamfering edges... "The work changes."

A diamond tool specialized manufacturer has responded to the voices from the field. The usage is flexible, and you can choose the type according to your work. There are various uses, including carbide, high-speed steel, die steel, and difficult-to-cut materials. We can accommodate with resin. By adding a few drops of water, the cutting performance improves. For more details, please download the catalog or contact us.

Company：インターナショナルダイヤモンド
Price：Other

Grindstone
Hand polishing and filing
Diamond grinding wheel

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For chamfering and deburring! Diamond grinding stone Magic Stone

Use it by placing it down, use it by holding it. Quickly remove dirt, smoothly level the surface, and effortlessly chamfer the edges... 'The work changes.'

A specialized manufacturer of diamond tools has responded to the voices from the field. The usage is flexible, and you can choose the type according to your work. For deburring and chamfering, you can achieve a faster, more stable, and uniform surface compared to files and hand stones. There are various applications for hard materials, high-speed steel, die steel, and difficult-to-cut materials. We accommodate with resin. By adding a few drops of water, the cutting performance improves. For more details, please download the catalog or contact us.

Company：インターナショナルダイヤモンド
Price：Other

Grindstone
Diamond grinding wheel

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Sintered diamond grinding wheel

This grinding stone is compatible not only with electric grinders but also with air grinders!

We handle "sintered diamond grinding wheels" for free grinding, which combine the characteristics of grinding wheels with the cutting ability of diamonds. The semi-porous (multi-porous) type of special sintering suppresses clogging and heat generation. Moderate self-sharpening action maintains a sharp cutting edge. 【Features】 ■ Combines the characteristics of grinding wheels with the cutting ability of diamonds ■ Suppresses clogging and heat generation while maintaining a sharp cutting edge through moderate self-sharpening ■ Soft feel with minimal grinding burn even in dry conditions ■ Compatible with high-speed rotation (80,000 min-1) *For more details, please download the PDF or feel free to contact us.

Company：永興電機工業
Price：Other

Grindstone
Diamond grinding wheel

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Diamond sharpening stone

For sharpening ultra-hard chisels! Equipped with a 2000-grit metal bond diamond grinding stone!

The "Diamond Grinding Stone" is a product that fixes a 2000-grit metal bond diamond grinding stone into a groove on an aluminum base. It can be used for sharpening carbide chisels. 【Specifications】 ■ Aluminum base dimensions: Width 30 × Height 15 × Length 110 mm ■ Metal bond diamond grinding stone: 2000 grit *For more details, please refer to the PDF document or feel free to contact us.

Company：ハープ
Price：Other

Other work tools
Other cutting tools
Grindstone
Diamond grinding wheel

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High-efficiency flat grinding diamond wheel 'DX WHEEL'

Demonstrating exceptional sharpness! Two types available for selection according to your needs.

The "DX WHEEL" is a high-efficiency diamond grinding wheel that can be used with the same feel as GC grinding wheels for flat grinding. It demonstrates exceptional cutting performance when grinding non-ferrous materials such as carbide and ceramics, as well as difficult-to-machine materials like composite molds. Additionally, there are two types available for selection based on application. Furthermore, dressing with raw materials is easy, making it economically advantageous. 【Features】 ■ Can be used with the same feel as GC grinding wheels ■ Exceptional cutting performance for non-ferrous materials and difficult-to-machine materials like composite molds ■ Two types available for selection based on application ■ Easy dressing with raw materials, providing excellent economy *For more details, please refer to the PDF document or feel free to contact us.

Company：TKX
Price：Other

Grindstone
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Precision diamond grinding wheel

Achieved high-efficiency grinding of advanced electronic component materials! Capable of intake and exhaust of water and air.

The "Precision Diamond Grinding Wheel" has a higher bonding strength in the diamond section compared to the core part. When the workpiece is pressed against it, the core part wears out faster. The diamond section is approximately 10 microns higher, ensuring that the workpiece is always in contact with the diamond. The size of the core part and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution on the diamond, which maximizes the grinding wheel's capabilities. Additionally, it is a porous body with over 40% porosity, allowing for the ingress and egress of water and air. 【Features】 ■ The abrasive grains in the core part improve processing efficiency due to the action of free abrasive grains. ■ Maximizes non-dress and dress intervals. ■ Load distribution can be controlled through diamond patterning. ■ Achieves high-efficiency processing and reduces total costs. *For more details, please refer to the related links or feel free to contact us.

Company：ナノテム
Price：Other

Grindstone
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Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination

Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?

"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduces total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduces total costs *For more details, please refer to the PDF document or feel free to contact us.

Company：ナノテム
Price：Other

Grindstone
Wafer processing/polishing equipment
Other abrasives
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Resin diamond grinding wheel for insert outer circumference grinding

High geometric precision and excellent material removal capability.

● Mainly used for grinding the end faces, radii, and clearance angles of indexable cutting inserts, flat cutters, milling tools, cutting blades, welding blades, clip blades, carbide, ceramics, cermet, PCD, CBN, etc. ● Types: 6A2H, 11A2, 11A2B, 2A2T, 11A2H, 12A2T, 15A2T ● The outer peripheral grinding diamond wheels for indexable cutting inserts require high geometric precision and excellent material removal capability. Our company can manufacture various wheels compatible with grinding machines such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc.

Company：MORE SUPER HARD PRODUCTS CO.,LTD.
Price：10,000 yen-100,000 yen

Grindstone
lathe
Grinding Machine
Diamond grinding wheel

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Diamond AA Stick

Grinding wheel molded from thermosetting resin.

＝＝＝＝＝ Features ＝＝＝＝＝ Can grind materials such as hardened steel, ceramics, and carbide. Ideal for grinding discharge machining plates, flat surfaces, grooves, and gaps.

Company：サクラダイヤモンドツール研究所
Price：Other

Grindstone
Ceramics
Diamond grinding wheel

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DMT Diamond Sharpening Stone

Since it is a diamond sharpening stone, no flattening is necessary! Water sharpening is fine!! It uses single crystal natural diamonds, so it sharpens remarkably quickly. There are various sizes and shapes available according to your needs. For details and the catalog, please visit our website.

Company：協和機工
Price：Other

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Electroplated Diamond/CBN Catalog

A large number of electrodeposited bars made of high rigidity stainless steel, strong against bending and breaking.

The "Electroplated Diamond Catalog" features grinding wheels that are electroplated with high-quality diamonds or CBN abrasives onto a stainless steel substrate. We also offer electroplated bars that are strong against bending and breaking when subjected to radial loads, using high-rigidity stainless steel as the substrate. Due to its long neck design, the effective length of the electroplated section can be utilized efficiently, significantly improving the grindability for deep holes and grooves. 【Features】 ■ Diamond abrasives ■ CBN abrasives ■ High rigidity ■ Strong against bending and breaking ■ Shipping unit: 1 piece *For more details, please refer to the catalog or feel free to contact us.

Company：クレステック
Price：Other

Diamond cutter
Other machine tools
Diamond grinding wheel

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Hand Meister Series "Multi Finish"

It is resistant to deformation and has a long lifespan.

It is a bond with a strong ability to retain abrasive particles unique to diamond-petrified materials, making it resistant to shape distortion and providing a long lifespan. It can be used for chamfering, deburring, and finishing, making it a versatile tool to have in the workplace. 【Features】 - Excellent cutting ability that is not limited to specific materials - Outstanding durability For more details, please contact us or download the catalog.

Company：インターナショナルダイヤモンド
Price：Other

Hand polishing and filing
Diamond grinding wheel

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"Use it placed down, use it held" Diamond sharpening stone Magic Stone

Use it while it's placed, use it while holding it. Quickly remove dirt, swiftly smooth the surface, and make a single pass for edge beveling... 'Your work will change.'

A specialized manufacturer of diamond tools has responded to the voices from the field. The usage is flexible, and you can choose the type according to your work. With a wider grinding surface than files and hand stones, and by holding the parts for processing, it provides stability and allows for quick and uniform chamfering. It can be used with various materials such as carbide, high-speed steel, die steel, and difficult-to-cut materials. It is compatible with resin. Adding a few drops of water enhances cutting performance. For more details, please download the catalog or contact us.

Company：インターナショナルダイヤモンド
Price：Other

Grindstone
Hand polishing and filing
Other abrasives
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Precision cutting diamond grinding wheel "DIA-STONE"

Introducing ultra-thin diamond grinding stones that have a long-lasting sharpness and extremely high processing efficiency!

"Diamond Stone" is a resin-bonded diamond cutting wheel developed for grooving and cutting ceramic and composite materials (difficult-to-machine materials) using diamond abrasive grains molded with a resin binder. Compared to electroplated bond and metal bond, it is rich in elasticity, provides a soft touch to the workpiece, generates less chipping, offers superior quality of the cutting surface, and allows for smooth self-sharpening of the cutting edge. Additionally, it has a long-lasting cutting ability and extremely high processing efficiency. 【Features】 ■ Ultra-thin diamond grinding wheel ■ Rich in elasticity with a soft touch to the workpiece ■ Generates less chipping ■ Superior quality of the cutting surface with smooth self-sharpening of the cutting edge ■ Long-lasting cutting ability and extremely high processing efficiency *For more details, please refer to the PDF document or feel free to contact us.

Company：ニップラ
Price：Other

Grindstone
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Diamond grinding stone "Dicing Blade"

Enables high-speed cutting of hard-to-machine materials such as sapphire, quartz glass, and silicon!

"Dyshing Blade" is a completely custom-made diamond grinding stone. It features a blade design that can accommodate groove shapes and more. It has a porous structure with a porosity of 40%. It demonstrates exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics. 【Features】 ■ Porous structure with 40% porosity ■ Blade design that can accommodate groove shapes and more ■ Completely custom-made ■ Exceptional performance in high-speed cutting of difficult-to-machine materials such as sapphire, quartz glass, silicon, and ceramics *For more details, please refer to the related links or feel free to contact us.

Company：ナノテム
Price：Other

Grindstone
Diamond grinding wheel

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Special Diamond Grinding Stone "UNIVA-X SPECIAL"

A special grinding stone has been created that can surprisingly cut and polish hard materials like SiC and sapphire!

The "UNIVA-X SPECIAL" is a grinding wheel that promises high-efficiency processing and a reduction in total costs. Diamond abrasive grains are arranged in SPIKE & SPIRAL shapes. The abrasive grains in the core are selected to efficiently utilize the action of free abrasive grains. Since it allows for free shape design according to the type of material being ground, it enables grinding and polishing of various materials as desired. 【Features】 ■ Diamond abrasive grains arranged in SPIKE & SPIRAL shapes ■ Free shape design possible according to the type of material being ground ■ Promises high-efficiency processing and reduction in total costs ■ Reduces waste of the grinding wheel during dressing ■ Load distribution can be controlled through diamond patterning *For more details, please download the PDF or feel free to contact us.

Company：ナノテム
Price：Other

Grindstone
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JAM Diamond Grinding Stone Resin Bond Type DTL-3000

Resin bond type developed for fitting, lapping, and fine edge rounding of mold parts and machine components.

[Applicable Materials] Tungsten carbide, hardened steel, general steel, ceramics, glass, silicon, ferrite, porcelain, stone, carbon, gemstones, FRP, etc. Note: This grinding stone cannot be used for high-speed rotation or sliding processing when mounted on a machine.

Company：日本オートマチックマシン
Price：Other

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Diamond grinding wheels for semiconductor manufacturing for power semiconductors.

A grinding wheel that improves the efficiency of SiC wafer polishing and contributes to enhanced heat resistance.

In the power semiconductor industry, high-precision processing and efficient handling of materials are required. In particular, when polishing difficult-to-cut materials such as SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing SiC wafers - Polishing wafers of other difficult-to-cut materials 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

Company：ナノテム
Price：Other

Grindstone
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Diamond grinding wheels for semiconductor manufacturing for substrate materials.

Grinding wheels that enhance the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.

In precision polishing of substrate materials, high-precision processing and efficient handling of materials are required. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

Company：ナノテム
Price：Other

Grindstone
Diamond grinding wheel

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Diamond grinding wheels for semiconductor manufacturing for memory semiconductors.

Improving the efficiency of wafer polishing for hard-to-cut materials such as SiC and sapphire to enhance yield.

In the wafer polishing of the memory semiconductor industry, high-precision processing and efficient material handling are required to improve yield. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to enhancing productivity, reducing costs, and ultimately improving yield. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges and achieves high-efficiency processing and total cost reduction. 【Usage Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

Company：ナノテム
Price：Other

Grindstone
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Diamond grinding wheels for semiconductor manufacturing for image sensors.

A grinding wheel that enhances the efficiency of microfabrication for image sensors.

In the image sensor industry, precision machining and efficient processing of materials are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased machining accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency machining and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

Company：ナノテム
Price：Other

Grindstone
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JAM 【Diamond Grinding Stone】 DTL-2000/3000

Auxiliary tools for high-precision machining and measurement.

The material is SKS. Hardened to HRC60° and finished with grinding. ● Sign bars for angle setting and measurement ● Positioning auxiliary blocks suitable for both cutting and grinding processes ● Auxiliary dressers for shaping grinding wheel on grinding machines ● Grinding wheels for polishing and lapping of machine parts, mold parts, etc. ● This is a resin bond type diamond grinding wheel suitable for fitting, lapping, and fine edge rounding of mold parts and machine parts. Applicable materials: carbide, hardened steel, general steel, ceramics, glass, silicon, ferrite, porcelain, stone, concrete, carbon, gemstones, FRP.

Company：日本オートマチックマシン
Price：Other

Vice Clamps
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JAM Diamond Grinding Stone Resin Bond Type DTL-1000

Resin bond type developed for fitting, lapping, and fine chamfering of mold parts and machine components.

[Applicable Materials] Tungsten carbide, hardened steel, general steel, ceramics, glass, silicon, ferrite, porcelain, stone, carbon, gemstones, FRP, etc. Note: This grinding wheel cannot be used for high-speed rotation or sliding processing when mounted on a machine.

Company：日本オートマチックマシン
Price：Other

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Diamond grinding wheel 'UNIVA-X SPECIAL' for semiconductor manufacturing

Grinding wheels that enhance the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.

In the semiconductor manufacturing industry, wafer polishing requires high-precision processing and efficient material handling. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Introduction】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

Company：ナノテム
Price：Other

Grindstone
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Diamond grinding wheels for semiconductor manufacturing for logic semiconductors.

Grinding wheels that improve the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.

In the wafer polishing of the logic semiconductor industry, high-precision processing and efficient material handling are required. Particularly in the polishing of hard-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, achieving high-efficiency processing and reducing total costs. 【Application Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of hard-to-cut materials 【Benefits of Implementation】 - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction of dressing frequency

Company：ナノテム
Price：Other

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Diamond grinding wheels for semiconductor manufacturing for SiC wafers.

A grinding wheel that efficiently maintains the flatness of SiC wafers.

In the polishing of SiC wafers, it is essential to perform high-precision processing while maintaining flatness. Particularly in the polishing of difficult-to-machine materials like SiC, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The use of inappropriate grinding wheels can lead to decreased processing accuracy, damage to the wafers, and even stoppages in the production line. The special diamond grinding wheel 'UNIVA-X SPECIAL' addresses these challenges, achieving the maintenance of flatness and high-efficiency processing for SiC wafers. 【Application Scene】 - Polishing of SiC wafers 【Effects of Introduction】 - Maintenance of flatness through high-precision polishing - Reduction of processing time - Cost reduction through extended grinding wheel lifespan - Decreased dressing frequency

Company：ナノテム
Price：Other

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Diamond grinding wheels for semiconductor manufacturing for GaN wafers.

A grinding wheel that improves the surface quality of GaN wafers and enhances polishing efficiency.

In the GaN wafer manufacturing industry, achieving high-precision surface quality and efficient material processing is essential. Particularly in the polishing of difficult-to-machine materials like GaN, reducing processing time and extending the lifespan of grinding wheels are key to improving productivity and reducing costs. The improper use of grinding wheels can lead to decreased surface quality, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges, enabling high-efficiency processing and total cost reduction. 【Application Scenarios】 - Polishing of GaN wafers - Polishing of other difficult-to-machine material wafers 【Benefits of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Decreased dressing frequency

Company：ナノテム
Price：Other

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Diamond grinding wheel Product List and Ranking from 12 Manufacturers, Suppliers and Companies | IPROS GMS

Diamond grinding wheel Manufacturer, Suppliers and Company Rankings

Diamond grinding wheel Product ranking